Electronic Products & Technology

Pre-cured, single component silicon solution minimizes the mix

March 8, 2018  Stephen Law

SHIN-ETSU SILICONES  CLG series single-component, pre-cured gap filler silicones improve resistance against pump-out for advanced thermal management electronics applications. Gap filler greases are simpler to use, requiring no mixing or use of a two-part meter-mix equipment system. Material does not need to cure after it is dispensed so there is no time-consuming waiting or heating involved to cure after dispensing–and no resulting curing process by-products. The materials offer a low volatile content with excellent resistance to pump-out and creeping. Featuring a gel-like consistency, the material is applicable on a myriad of surface shapes–easily filling voids between heat sources and heat sinks.

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