
Pre-cured, single component silicon solution minimizes the mix
March 8, 2018 Stephen Law
Electronics
Thermal management
Contract Manufacturing
Engineering
Supply Chain
gap fille
gap fille
silicon
silicon
thermal
thermal management
Thermal management
SHIN-ETSU SILICONES CLG series single-component, pre-cured gap filler silicones improve resistance against pump-out for advanced thermal management electronics applications. Gap filler greases are simpler to use, requiring no mixing or use of a two-part meter-mix equipment system. Material does not need to cure after it is dispensed so there is no time-consuming waiting or heating involved to cure after dispensing–and no resulting curing process by-products. The materials offer a low volatile content with excellent resistance to pump-out and creeping. Featuring a gel-like consistency, the material is applicable on a myriad of surface shapes–easily filling voids between heat sources and heat sinks.
Leave a Reply