Pcb miniaturization technology platform suits medical apps

CICOR DenciTec technology platform enables a high density of integrated functions for printed circuit boards, with high throughput and lowers costs. Suitable for medical applications and miniaturized 3D pcbs, product enables the production of circuits with extremely high density without the disadvantages of existing established manufacturing processes. Miniaturization possibilities include conductor widths and spacings down to 25µm with copper thicknesses of 20 +/- 5µm on all conductive layers, laser-via diameters of 35µm, annular rings with a diameter of 30µm for the inner layers and 20µm for the outer layers, copper-filled blind vias with the option of via stacking, and vias-in-pads.

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