Electronic Products & Technology


Products


Product
May 3, 2020

Convection soldering system delivers cooling options

REHM THERMAL SYSTEMS VisionXP+ convection soldering system provides different types of cooling. For an optimal reflow soldering result, not only is melting of the solder important but also as a stable and reliable cooling process. With firm’s CoolFlow, product offers

Product
May 2, 2020

Ambient light sensors come in standard SMT package

ROHM SEMICONDUCTOR Ambient light sensors (ALS) ICs are available in industry standard surface mount packages. Devices are specifically targeted at LCD/LED displays, hand-held products and mobile devices where power consumption is critical. ICs are designed to control the brightness of

Product
May 1, 2020

4.5W thermal putty serves as thermal interface

FUJIPOLY AMERICA Sarcon PG45A high-performance, putty-like thermal interface material is a low modulus gap filler that exhibits a thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with a thermal conductivity of 4.5W/m°K. Product requires very low compression force at

Product
May 1, 2020

Tailor-made superjunction MOSFET perform in automotive designs

INFINEON TECHNOLOGIES CoolMOS CFD7A series silicon-based, high-performance tailor-made superjunction MOSFET can be used in both the PFC and the dc-dc stage of on-board charger systems and HV-LV dc-dc converters specifically optimized for electric-vehicle applications. Device is fully compatible with system

Product
April 30, 2020

Component carrier replaces flexible pcbs

HARTING Standardized component carrier solution, based on 3D-MID technology, is capable of replacing flexible circuit boards. Electronic components can be fitted directly onto the component carrier, which serves as a connecting element between the printed circuit board (pcb) and electronic

Product
April 30, 2020

Pick-and-place machine expands in any direction

ESSEMTEC FOX2 smart-sized modular pick-and-place technology is expandable in any direction. Unit combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine. Product has a machine footprint of just under 11 sq. ft and can accept

Product
April 29, 2020

Half-brick power module operates from 200 to 425Vdc input

TDK-LAMBDA AMERICAS PH600A280-24 dc-dc converter is rated at 24V 600W, further extending the 280Vdc nominal input PH-A series from 50W to 600W. Product series is utilized in HVDC (High Voltage Direct Current) equipment for data communications, high voltage transmission, renewable

Product
April 29, 2020

Wi-Fi + Bluetooth 5.1 RF module serves industrial IoT devices

TTI Murata Type 1DX Wi-Fi + Bluetooth 5.1 RF Module is a high-performance module based on the Cypress CYW4343W combo chipset which supports Wi-Fi 802.11b/g/n + Bluetooth 5.1 BR/EDR/LE up to 65Mbps PHY data rate on Wi-Fi and 3Mbps PHY

Product
April 28, 2020

Flanged extruded aluminium enclosure for surface mounting

HAMMOND MANUFACTURING 1455F flanged extruded aluminium enclosures add a further variant to the popular 1455 standard family. Product features a new extrusion with flat base and integral mounting flanges, which extend beyond the body of the unit. Flanges have four

Product
April 28, 2020

2nd gen processors redefine performance for database, commercial HPC

AMD 2ndGen AMD EPYC processor family with three new processors combine the balanced and efficient AMD Infinity architecture with higher speed ‘Zen 2’ cores for optimal performance on database, commercial high-performance computing (HPC) and hyper-converged infrastructure workloads. AMD EPYC 7F32

Product
April 27, 2020

Flexible, low-loss cable assembly performs to 67GHz

SAMTEC RF047-A flexible low-loss cable assembly with performance up to 67GHz, uses 1.85mm male and female connectors, operates to 67GHz with a maximum VSWR of 1.4:1 or better. Devices are solder clamp designs with fully captivated center contacts. The body

Product
April 27, 2020

Ultra-tiny MOSFETs are 36% smaller with low RDS(on)

NEXPERIA PMH family of ultra-small DFN0606-packaged MOSFETs for mobile and portable applications including wearables offer low RDS(on) for its size and employ the commonly used pitch of 0.35 mm to simplify pcb assembly processes. With a footprint of just 0.62