Products
Convection soldering system delivers cooling options
REHM THERMAL SYSTEMS VisionXP+ convection soldering system provides different types of cooling. For an optimal reflow soldering result, not only is melting of the solder important but also as a stable and reliable cooling process. With firm’s CoolFlow, product offers…
Ambient light sensors come in standard SMT package
ROHM SEMICONDUCTOR Ambient light sensors (ALS) ICs are available in industry standard surface mount packages. Devices are specifically targeted at LCD/LED displays, hand-held products and mobile devices where power consumption is critical. ICs are designed to control the brightness of…
4.5W thermal putty serves as thermal interface
FUJIPOLY AMERICA Sarcon PG45A high-performance, putty-like thermal interface material is a low modulus gap filler that exhibits a thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with a thermal conductivity of 4.5W/m°K. Product requires very low compression force at…
Tailor-made superjunction MOSFET perform in automotive designs
INFINEON TECHNOLOGIES CoolMOS CFD7A series silicon-based, high-performance tailor-made superjunction MOSFET can be used in both the PFC and the dc-dc stage of on-board charger systems and HV-LV dc-dc converters specifically optimized for electric-vehicle applications. Device is fully compatible with system…
Component carrier replaces flexible pcbs
HARTING Standardized component carrier solution, based on 3D-MID technology, is capable of replacing flexible circuit boards. Electronic components can be fitted directly onto the component carrier, which serves as a connecting element between the printed circuit board (pcb) and electronic…
Pick-and-place machine expands in any direction
ESSEMTEC FOX2 smart-sized modular pick-and-place technology is expandable in any direction. Unit combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine. Product has a machine footprint of just under 11 sq. ft and can accept…
Half-brick power module operates from 200 to 425Vdc input
TDK-LAMBDA AMERICAS PH600A280-24 dc-dc converter is rated at 24V 600W, further extending the 280Vdc nominal input PH-A series from 50W to 600W. Product series is utilized in HVDC (High Voltage Direct Current) equipment for data communications, high voltage transmission, renewable…
Wi-Fi + Bluetooth 5.1 RF module serves industrial IoT devices
TTI Murata Type 1DX Wi-Fi + Bluetooth 5.1 RF Module is a high-performance module based on the Cypress CYW4343W combo chipset which supports Wi-Fi 802.11b/g/n + Bluetooth 5.1 BR/EDR/LE up to 65Mbps PHY data rate on Wi-Fi and 3Mbps PHY…
Flanged extruded aluminium enclosure for surface mounting
HAMMOND MANUFACTURING 1455F flanged extruded aluminium enclosures add a further variant to the popular 1455 standard family. Product features a new extrusion with flat base and integral mounting flanges, which extend beyond the body of the unit. Flanges have four…
2nd gen processors redefine performance for database, commercial HPC
AMD 2ndGen AMD EPYC processor family with three new processors combine the balanced and efficient AMD Infinity architecture with higher speed ‘Zen 2’ cores for optimal performance on database, commercial high-performance computing (HPC) and hyper-converged infrastructure workloads. AMD EPYC 7F32…
Flexible, low-loss cable assembly performs to 67GHz
SAMTEC RF047-A flexible low-loss cable assembly with performance up to 67GHz, uses 1.85mm male and female connectors, operates to 67GHz with a maximum VSWR of 1.4:1 or better. Devices are solder clamp designs with fully captivated center contacts. The body…
Ultra-tiny MOSFETs are 36% smaller with low RDS(on)
NEXPERIA PMH family of ultra-small DFN0606-packaged MOSFETs for mobile and portable applications including wearables offer low RDS(on) for its size and employ the commonly used pitch of 0.35 mm to simplify pcb assembly processes. With a footprint of just 0.62…