Electronic Products & Technology


Products


Product
May 12, 2019

40nm integrated power management unit IP cores optimized for wireless

VIDATRONIC PMU IP series of integrated power management unit (PMU) IP cores are silicon-proven in the TSMC 40nm process. Devices are optimized for integration into Application Specific Integrated Circuits (ASICs) or Systems-on-a-Chip (SoCs), including radio frequency (RF), wireless and narrowband

Product
May 11, 2019

Supercapacitors deliver low ESR

EATON KW and KR series of supercapacitors deliver low ESR for high power density with environmentally friendly materials for a green power solution. Devices are maintenance-free with design lifetimes up to 20-years and operating temperatures down to -40°C and up

Product
May 10, 2019

3U VPX board optimizes high-speed optical, RF I/O connectivity

PENTEK Model 54851 Jade family of high-performance 3U VPX boards is based on the Xilinx Kintex Ultrascale FPGA and features two 500 MHz 12-bit A/Ds with two programmable multiband digital downconverters (DDCs) and one digital upconverter (DUC) with two 800MHz 16-bit

Product
May 10, 2019

Connector System comes with gold plating

MOLEX PicoBlade wire-to-board and wire-to-wire connector system is now available with gold plating. The terminal’s two-point contact design delivers a secure electrical connection, even under low-current, low-voltage and high-vibration conditions. The crimp receptacle features two latching ramps to minimize uncoupling

Product
May 9, 2019

USB 3.0 type-A vertical connectors support 5Gbps data speeds

BEL Stewart Connector USB 3.0 Type-A vertical connector support data speeds up to 5Gbps for USB 3.0. Device has plug/play capabilities where hot insertion/ejection may occur without issue, under a load. Devices are plated with 30 micro-inches of gold on

Product
May 9, 2019

Shielded surface mount power inductors serve high reliability designs

API DELEVAN Series HRSPD127, shielded surface mount power inductors provide reliable operation in harsh environments. Devices are built to meet mechanical shock, high-frequency vibration, solderability and moisture resistance per MIL-STD-202, thermal shock per MIL-PRF-27 and SnPb reflow profile per MIL-PRF-83446.

Product
May 8, 2019

DIN rail mount redundancy module assists load current balancing

TDK-LAMBDA AMERICAS DRM40 series DIN rail mount redundancy modules are available in two 20A 10V to 30Vdc rated inputs and can be connected to provide a 20A redundant configuration, or using the load balancing option, to deliver a 40A output.

Product
May 8, 2019

LED Indicator offers RGB illumination lens options

APEM Q Series LED Indicator line now includes RGB illumination lens option and can be customized to provide a vast assortment of tones and colors, including cyan, magenta, yellow and white. The LED lens is available in flush or prominent

Product
May 7, 2019

Arm Cortex-M33-based MCUs boost security, processing

MOUSER NXP Semiconductors LPC55S6x microcontrollers provide improved levels of security, processing efficiency and functionality. Devices feature dual Arm Cortex-M33 cores and Arm TrustZone technology for industrial, building automation, Internet of Things (IoT) edge computing, diagnostic equipment and consumer electronics applications.

Product
May 7, 2019

LCD operates in extreme cold

TIANMA GROUP SLT (Super Low Temperature) technology allows LCDs to function normally in extremely low temperatures, down to -45 degrees Celsius. This technological advancement adopts a proprietary new design scheme, process and materials, all to solve the response time problem

Product
May 6, 2019

Teaching solution assists on RF microwave circuit design, simulation, measurement

KEYSIGHT TECHNOLOGIES RF Microwave Teaching Solution is a radio frequency (RF) microwave circuit design, simulation and measurement solution that provides students with engineering essentials, practical skills and everyday application knowledge to help them successfully develop 5G and IoT wireless applications.

Product
May 6, 2019

Dual curing epoxy meets biocompatibility, cytotoxicity needs

MASTER BOND UV22DC80-1Med single component, nanosilica filled compound features a UV and heat curing mechanism. Product passes USP Class VI tests for biocompatibility, while also meeting ISO 10993-5 for cytotoxicity, making it suitable for many applications in the medical device