Electronic Products & Technology

Open pin field interconnect meets high-speed, high density demands

EP&T Magazine   


SAMTEC SEARAY Open Pin Field Interconnect line supports the demands of high speed applications requiring highly reliable, high pin count solutions. The latest additions product family is a Right Angle design suitable for perpendicular and high speed micro backplane applications and a Press-Fit design that combines the flexibility and convenience of press-fit tails with superior signal integrity and mechanical performance. Both designs use a 1,27mm x 1,27mm grid array to achieve maximum grounding and routing flexibility and feature Samtec’s robust, signal integrity-optimized Edge Rate contact system.



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