One-part silver conductive epoxy delivers ultra-high heat transfer

MASTER BOND EP3HTSDA-2 Silver filled epoxy adhesive system serves crucial thermal management applications. As a one component system, it is not premixed and frozen and has an ‘unlimited’ working life at room temperature. Compound possesses a high thermal conductivity of 45-49 BTU•in/ft²•hr•°F [6.5-7.0 W/(m•K)]. It can be applied in ultra thin bond lines and contains particles with an average size of 2-3 microns. Product exhibits very low thermal resistance of 2-3 x 10 ^-6 K•m²/W.