One component epoxy meets low outgassing specs
Stephen LawElectronics Production / Materials Supply Chain component component epoxy epoxy
MASTER BOND EP17HTND-CCM single component epoxy is not premixed or frozen and is more convenient to handle, apply and store than typical two component glob top systems. The black, heat curable compound has a flowable paste consistency suitable for glob top, chip coating and bonding applications. Product meets NASA low outgassing specifications and is serviceable from -62°C to +316°C. Adhesive forms high strength bonds to a wide variety of similar/dissimilar substrates such as metals, ceramics, plastics, composites and various circuit board materials. Product is thermally conductive and electrically non-conductive even upon exposure to hostile environmental conditions. Product has a high volume resistivity of more than 1015 ohm-cm at 75°F and over 1012ohm-cm at 400°F. Its thermal conductivity is 9-10 BTU•in/ft2•hr•°F [1.4423 W/(m•K)] at 75°F.
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