Non-conductive die attach film delivers broad wirebond package flexibility
Stephen LawElectronics Production / Materials materials production
HENKEL Loctite Ablestik ATB 125GR high-performance non-conductive die attach film (ncDAF) addresses the demands of contemporary packaging device designs. The high-reliability ncDAF is suitable for wirebond laminate and lead frame packages, compatible with small- to medium-sized die, and formulated to provide excellent workability and processability. As 3D packaging miniaturization accelerates across the microelectronics market, smaller, thinner, high-density package structures are the norm. For these reasons, many packaging specialists opt for die attach film materials instead of pastes to enable more challenging dimensions. Compared to pastes, die attach films offer controlled thickness and flow, no resin bleed, consistent fillet formation and bond line stability before and after cure. Product provides these advantages in addition to high-reliability, Automotive Grade 0 performance for both laminate and lead frame designs.
Print this page