Non-conductive die attach adhesive suits image sensors, circuit assembly
ENGINEERED MATERIAL SYSTEMS DA-6010 Non-Conductive Die Attach Adhesive is suitable for image sensor attach or chip on board applications. Product has a moderate glass transition temperature (Tg) and modulus. With an optimized rheology for needle dispensing by time-pressure, auger or positive displacement, product adheres to both flexible and rigid substrates. Electronic materials are suitable for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.
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