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Non-collapsible solder columns serve surface-mount pcbs


TOPLINE CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (pcbs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. Solution overcomes 10ppm/oC mismatch of coefficient of thermal expansion (CTE) between large ceramic IC packages and glass-epoxy pcbs. Solder columns on CCGA packages are compliant and absorb strain in applications typically found in the fields of military, aerospace and defense where significantly varying temperatures, high vibration and shock are present.


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