No clean solder paste is low-voiding

AIM SOLDER V9 low-voiding, no clean solder paste is formulated to reduce voiding to as low as 1% on BGA and <5% on BTC components, while exhibiting stable print performance on fine feature devices over 12 hours. Product’s post-process residue is easily probed and possesses the high SIR values required for high reliability applications. Both REACH and RoHS compliant, product is available in SAC305 T4. Producct is proven to improve production yields and product quality, whether printing 0.50 area ratios or eliminating voiding on BGA and BTC packages.

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