Kester NXG33 Lead-free, no-clean solder paste is halogen-free and improves printability. Product’s enhanced solderability reduces BGA voiding and produces clear, probe able residues. Product is fully capable of printing and reflowing 01005 components, even in air reflow, with minimal graping behavior. Product can handle a wide variety of printer variables, including print speed, long idle times and a wide range of temperature and humidity. Post-soldering, it minimizes defects, including headin-pillow and QFN/BGA voiding.
Advertisement
Stories continue below
