Next gen adhesive is thermally, electrically conductive

ROGERS CoolSpan Teca thermosetting, epoxy based, silver filled adhesive film is used in bonding high power circuit boards and has a storage life of up to 12 months from date of manufacture. Films provide a convenient and reliable approach to bond high power circuit boards, heavy metal back-planes, heat sink coins and RF module housings. This approach overcomes voiding and flow issues that are problematic for sweat soldering and dispensed adhesive approaches. COOLSPAN TECA films can be tack soldered in a fixture, ensuring accurate registration. This is followed by a tooled thermal cure or PCB press cycle.

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