MOSFETs top-side cooling simplifies design for compact power solutions

ONSEMI Series of MOSFET devices feature innovative top-side cooling to assist designers in challenging automotive applications, especially within motor control and dc-dc conversion. Housed in a TCPAK57 package measuring 5mm x 7mm, devices provide a 16.5mm2 thermal pad on the top side. This allows heat to be dissipated directly into a heatsink rather than via a typical printed circuit board (pcb). By enabling the use of both sides of the pcb and decreasing the amount of heat going into it, device provides increased power density. Improved reliability of the new design adds to an overall extended system lifetime.

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