MOSFETs deliver class-leading power dissipation in compact package

ROHM RA1C030LD compact, high efficiency 20VNch MOSFET is optimized for switching in small, thin devices, including smartphones and wearables such as wireless earbuds and other hearable equipment. Developed in wafer-level chip-size packages (WLCSP), devices contribute to greater miniaturization while maintaining the necessary characteristics is becoming mainstream in the industry. Device delivers low power loss, as firm leverages its strengths as an IC manufacturer to significantly reduce wiring resistance (which has increased with conventional discrete processes). Products are available in the DSN1006-3 wafer-level, chip-size package (1.0mm × 0.6mm) that takes advantage of firm’s proprietary IC process to achieve low power dissipation together with greater miniaturization.

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