Electronic Products & Technology

Modular die bonder delivers flexibility, precision, placement accuracy

EP&T Magazine   


FINETECH FINEPLACER Lambda Modular die bonder is suitable for low-volume, prototyping and R&D environments requiring flexibility, precision, advanced technologies and the highest bonding placement accuracy (down to 0.5 µm). This versatile system can be used for precise placement, die-attach and advanced packaging using various bonding technologies – soldering (eutectic, Au/Sn, Indium), thermo compression, thermo-/ultrasonic bonding, gold/tin laser bar bonding, adhesives and UV curing. Options are available for inert atmosphere and forming gas.



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