Miniature surface mount ball test points lower profile

E-MARK 02-1180 low profile version of firm’s ball test point responds to the increasing packaging density of printed circuit boards. Devices enable simple attachment and removal of test probes without taking up unnecessary board real estate. Devices measure 1.4mm in height and a base of 1.5mm in diameter, thus requiring little space on the board. Contact resistance is < 2mO and the current rating is 3A. Devices are supplied on cut tape for prototyping and evaluation purposes or on 2000-piece tape and reel for production applications. The 1 mm diameter spherical ball is fully compatible with high-speed placement machines. The RoHS and REACH compliant devices are made of phosphor bronze, plated with gold over nickel to provide low contact resistance.