Material streamlines substrate coating processes

HENKEL Technomelt AS 8998 materials are suitable for high-performance low pressure molding applications. The newly-formulated product provides a streamlined and economical alternative to conventional masking techniques for various coating requirements. Product provides simple and fast dispensability to mask ‘keep out zones’ for printed circuit assemblies that will undergo subsequent coating or chemical deposition processes.   Product delivers a fast, highly-precise, automated, easy-to-remove approach to mask specific components or designated pcb areas that must remain free of any applied protective coatings.  http://www.henkel-adhesives.com/electronics