Low-volatility gap filler boosts thermal performance

HENKEL GAP FILLER 3500LV liquid gap filler material delivers high thermal conductivity and low volatility for reduced outgassing. The two-part material cures at room temperature with the option of accelerated curing through the addition of heat. While delivers high thermal conductivity of 3.5 W/m-K and the mechanical property benefits of a silicone, product does so with minimal outgassing. Once cured, product is a soft material that provides protection from shock and vibration. The liquid’s ability to fill tiny gaps and voids combined with its zero shrinkage characteristic ensure a high-reliability thermal interface for exceptional heat management. http://www.henkelna.com