Low viscosity, flexible resin system serves potting, encapsulating

HERNON MANUFACTURING Tuffbond 321 flexible, low viscosity, general-purpose resin system is used for casting, potting and encapsulating electrical and electronic components. Epoxy has low chlorine content and is formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties. Product is soft so that it can be folded over itself without damage. Delivering suitable clarity, product formula is also offered in black to obscure proprietary materials. Product is suitable for potting electronic boards; encapsulating electrical and electronic components; transformers; coils and chokes; solenoids; and micro circuitry

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