Low viscosity epoxy coating delivers acid resistance
Stephen Law
Electronics Production / Materials adhesive coating encapsulant epoxy material production sealantMASTER BOND EP21ARLV two part epoxy may be used as an adhesive, sealant, coating or encapsulant. Product is capable of withstanding prolonged exposure to a wide range of chemicals, such as 70% sulfuric acid, 10% hydrochloric acid, 10% nitric acid and butyl acetate to name a few. Both parts A and B have a low viscosity of 3,000-6,000 cps and 4,000-6,000 cps, respectively. Product provides low viscosity and acid resistance, making it suitable for potting and encapsulations in battery applications. Product’s mix ratio is 100 to 50 by weight, and it cures at room temperature. The addition of heat not only speeds up the curing process, but it is also vital for optimizing acid resistance. It is a reliable electrical insulator with a volume resistivity greater than 1014 ohm-cm at 75°F, and dielectric strength of 440 volts/mil at 75°F, for a 1/8 inch test sample.