Low thermal expansion epoxy passes NASA outgassing tests
MASTER BOND EP30LTE-LO two component epoxy is formulated with a blend of polymeric and inorganic materials and improves dimensional stability and performance for bonding, sealing, casting and coating applications in the aerospace, electrical, electronic, chemical, optical, and computer industries. Product combines enhanced performance with a low thermal expansion coefficient. Serviceable over the wide temperature range of -60F to 250F, product cures at room temperature with 85% of its maximum strength developed within 48-hours. Faster cures are possible at elevated temperatures.