Low-temperature lead-free solder paste saves sensitive components

SHENMAO AMERICA PF735-PQ10-10 low melting point, lead-free solder paste can reduce the reflow temperature to below 190°C, thus decreasing pcb and substrate deformation. Product saves energy, reduces thermal stability requirements of pcbs and components and increases yield rates, making it suitable for SMT devices with sensitive components. Product series offers some important benefits when it comes to SMT assembly. When compared with SnAgCu, products reduce peak reflow temperature, energy consumption and warpage of pcbs and components. In comparison with the Sn42/Bi58 Eutectic alloy, product delivers improved ductility, finer microstructure, and increased drop and thermal reliability.

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