Low silver solder solves process challenges
AIM SOLDER REL61 low silver solder alloy solves the process challenges associated with many other low/no silver solder alloys. Product provides a 10°C lower melting temperature and enhanced wetting performance versus SAC305, REL61 can lower process temperatures and prevents pcb damage. Available in paste, wire and bar formats, products are engineered for reliability, usability, and cost effectiveness.
Print this page