Low-profile, hybrid FPC-to-board connector supports 5A in miniature footprint
Stephen LawElectronics Interconnect connector Interconnect
HIROSE BM57 Series low-profile hybrid FPC-to-board connector provides a rated current of 5A power and 0.3A signal in a miniature footprint. With a 0.3 mm pitch, 0.6 mm stacking height and 1.9 mm width, the space-saving device is suitable for a wide range of consumer and portable electronic devices. A fully armored design covers both ends of the housing with metal for enhanced robustness and a significant reduction in the risk of housing damage from misalignment when mating. A wide self-alignment range of ±0.22mm in the pitch direction and ±0.3mm in the width direction, along with guidance ribs provides smooth mating operation. Offering enhanced PCB peeling strength, the rugged device features three solder retention tabs at each power contact. An insert molded header and receptacle prevents solder wicking into the contact area.