Low melting point paste designed for jet dispensing

SHENMAO AMERICA PF735-P267J Low Melting Point Lead-Free Jetting Solder Paste is designed for the jetting process. Product provides improved workability and solderability for automatic high-speed jetting production with superior accuracy and precision. Product’s low melting point alloy can reduce the reflow temperature to below 190°C compared to lead-free soldering, typically 240°-250°C, decreasing pcb and substrate deformation. Product provides energy savings, reduces the thermal stability requirement of PCBs and components, and raises yield rates. Halogen-free (ROL0) and complies with RoHS 2.0 and REACH.

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