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Low loss bondply delivers 6.15 dielectric constant


ROGERS RO4460G2 low loss bondply with a 6.15 dielectric constant (Dk) provides a 0.004” (0.101 mm) bonding layer that complements firm’s RO4360G2 low loss, glass-reinforced 6.15 Dk copper clad thermoset laminates. Product exhibits improved Dk control for repeatable electrical performance, a low z axis expansion for plated through hole reliability and thermoset bond temperatures compatible with standard epoxy/glass (FR-4) processes. Product serves multilayer designs requiring sequential laminations.


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