Light-curable low-shrink epoxy serves optical positioning applications
DYMAX Low Shrink OP-81-LS epoxy that cures in seconds upon exposure to broad-spectrum light for fast, precise optical assembly. Product has very low volumetric shrinkage during cure, low coefficient thermal expansion for stability through thermal excursions, and meets ASTM E595 outgassing requirements making it suitable for the positioning and bonding of lenses, prisms, fibers, or other optical components. The material does not react until exposed to light, so manufacturers have time to accurately align parts before assembly and cure. Epoxy features a low temperature (80-85°C) heat-curing function in applications where shadow areas exist or where only heat-cure is preferred. Material is solvent free and one component, requiring no mixing. Low-Shrink OP-81-LS is designed to bond dissimilar substrates, including polycarbonate, glass, acrylic, and metallic surfaces and is well suited for use in consumer electronics applications.