SHENMAO AMERICA PF606-P130N Anti-HoP lead free solder paste is designed for the SMT process to prevent head-on-pillow (HoP) issues. The demand for ultra-thin packages has increased, thus the reduction in package thickness has caused increased warpage. The warpage during the reflow process increases the gap between BGA components and solder paste, leading to HoP issues and production yield loss. Product features great flux activity that can prevent oxidation of solder powder during the reflow process. Paste shows improved solderability and hot slump performance to cover the warpage of components and prevent BGA/CSP HoP issues.
Advertisement
Stories continue below
