Lead-free solder paste is thermal fatigue resistant
SHENMAO AMERICA PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste is formulated with firm’s Sn/4Ag/3Bi Alloy design with high thermal impact reliability. Product can increase thermal reliability performance by a minimum of 30%. It boosts mechanical shock performance over typical solder alloys such as SAC305 and SAC405, and is suitable for use in consumer electronics, servers and automotive electronics applications. Product has a similar melting point to SAC305 so that the regular SAC305 reflow profile can be applied. With the innovative flux design, voiding can be easily controlled to less than 10%.