Lead-free solder paste displays thermal fatigue resistance

SHENMAO PF918-S High Reliability Solder Sphere and PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste is formulated with firm’s Sn/4Ag/3Bi Alloy design with high thermal impact reliability. PF918-S Solder Sphere shows more than two times the reliability in both drop test and thermal cycling test compared to SAC405 alloy on automotive electronic devices. PF918-P250 Solder Paste can increase thermal reliability performance by a minimum of 30 percent. Product provides improved mechanical shock performance than typical solder alloys such as SAC305 and SAC405, and is suitable for use in consumer electronics, servers and automotive electronics applications. PF918-P250 has a similar melting point to SAC305 so that the regular SAC305 reflow profile can be applied. Voiding can be easily controlled to less than 10 percent.

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