Electronic Products & Technology

Lead-free solder paste boosts reliability

February 3, 2014  EP&T Magazine

INDIUM BiAgX high-melting lead-free (Pb-free) solder paste technology is suitable for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, product has passed MSL1 and thermal cycle testing at several power semiconductor customers. Product excels in high temperature environments in excess of 150C and requires minimal process adjustments and no capital expenditures for customers converting from a standard high Pb-containing solder paste-based process.

http://www.indium.com


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