Lead-free solder alloy reduces voiding, tin whiskers

AIM SOLDER REL61 lead-free solder alloy addresses issues such as voiding, cost, durability and tin whiskers. Product has reduced voiding on BTC packages by more than 45%, increasing both thermal performance and solder joint integrity. Product delivers a low cost alternative to SAC alloys, with reliability and performance characteristics superior to SAC305 and other low/no-silver solder alloys. http://www.aimsolder.com