Lead-free paste specially designed for jet dispensing
Stephen LawElectronics Production / Materials materials production
PF606-P269J Lead-Free Jetting Solder Paste specially designed for the jetting process, provides improved workability and solderability for automatic high-speed jetting production with enhanced accuracy and precision. Product is halogen-free (ROL0) and complies with RoHS 2.0 and REACH. Paste is formulated with the SAC305 Alloy and powder size ranges from type 4 to type 7 for fine dot jetting. Product is suitable for fine pitch and ultra-fine pitch applications and devices with uneven, cavities and other difficult to print locations. Dot volume, size and shape are easy to adjust and optimize for each individual component and pad on the board by using the jetting system, making it applicable for fine-pitch devices and also minimizing the failure rate in production.