LCP laminates join stable of microelectronics packaging

ENDICOTT INTERCONNECT LCP Laminates joins firm’s family of microelectronics packaging product offerings. Custom designed LCP Laminates are suitable for semiconductor packages as LCP coreless designs for up to 6 layers as well as in combination with other rigid materials as hybrid circuits. Development and testing of Z-interconnect cross-sections for > 8 layer offerings are also underway. Film-based product provides high density interconnection with proven reliability and performance.

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