Electronic Products & Technology

LCP laminates join stable of microelectronics packaging

EP&T Magazine   


ENDICOTT INTERCONNECT LCP Laminates joins firm’s family of microelectronics packaging product offerings. Custom designed LCP Laminates are suitable for semiconductor packages as LCP coreless designs for up to 6 layers as well as in combination with other rigid materials as hybrid circuits. Development and testing of Z-interconnect cross-sections for > 8 layer offerings are also underway. Film-based product provides high density interconnection with proven reliability and performance.



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