Laser compression bonder provides warpage-free package bonding

LASERSSEL CLSR 6000 Laser Compression Bonder for semiconductor packages provides a soldering technique that uses high accuracy compression tools and Area Laser bonding introduced with LSRTM (Laser Selective Reflow) in order to minimize warpage on extremely thin packages and substrates. This technology has been adopted for high-end 2.5D packaging with dimensions larger than 60x60mm and NAND modules thinner than 50µm. Product can produce thin and large semiconductor packages with very high production yields at low cost that are now considered to dominate technology trends of top tier semiconductor and packaging providers.

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