Laminate line incorporates millimeter wave applications

ROGERS CORP. CLTE-MW laminate product line has been expanded to include lower profile and thinner copper foil options to better serve the needs of designers and pcb fabricators producing millimeter wave pcb circuit designs.  The low profile (VLP) ED copper cladding reduces insertion loss of transmission lines operating at 77GHz by about 20% compared to standard ED copper foil. The copper cladding option is available in 9µm, 18µm and 35µm thicknesses. The additional copper thickness options provide pcb fabricators more flexibility to achieve tight feature tolerances on signal layers, particularly with sequentially laminated designs.

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