Joint enhanced solder paste serves fine pad size
SHENMAO AMERICA (JEP) PF606-EP305 Joint Enhanced Solder Paste is an epoxy-based for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly. Product provides the advantages of both conventional solder paste and anisotropic conductive paste, i.e. self-alignment and planar insulation, respectively. The epoxy cures after reflow and provides improved bonding strength and joint protection. Joint reliability performance is elevated as well.