Interconnection solutions occupy 38% less space
TE CONNECTIVITY AMPMODU interconnection solutions 2mm receptacles, breakaway headers and shrouded headers occupy 38% less space than traditional 2.54mm (0.1 inch) centerline products, while reliably and economically meeting the packaging and inter-connection requirements of today’s miniature, sophisticated electronics. Available in vertical and right-angle orientations, the shrouded headers come in a double row configuration with through-hole or surface mount termination for ease of manufacturing. Headers can be mounted onto boards with thicknesses of 1.6mm or 2.4mm, providing customers with a wide range of options for pcb assembly. Devices offer an intermateable solution with major brand receptacles via a polarization feature that favors correct mating. Product is molded in a flame-retardant (UL94 V0) thermoplastic housing material that is resistant to reflow soldering temperatures, resulting in a high level of safety in harsh environments.