Integrated GaN SiP yields compact, fast-to-market solution

TRANSPHORM / WELTREND SEMICONDUCTOR WT7162RHUG24A GaN System-in-Package (SiP) is an integrated circuit designed for use in 45 to 100 watt USB-C PD power adapters charging smartphones, tablets, laptops, and other smart devices. Device provides peak power efficiency of greater than 93%. SiP enables OEMs to develop a less expensive system solution given fewer components are required and a smaller pcb can be used among other advantages. It also reduces system development time. SiP integrates Weltrend’s WT7162RHSG08 multi-mode flyback PWM controller with Transphorm’s 240 milliohm, 650 volt SuperGaN FET. The surface mount device is available in a 24-pin 8×8 QFN package, reducing PCB size.

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