Hybrid FPC-to-board connector combines low-profile with high-current capacity
HIROSE BK13C Series hybrid flexible printed circuit (FPC) to board connector saves space and boosts power capability. The low-profile device has a pitch of 0.35mm, stacking height of 0.6mm and width of 1.9mm. Device’s power contacts support up to 5A, while the signal contacts support 0.3A. Featuring a rugged molded housing covered by a metal shell, product’s fully armored design prevents housing damage when mating. Product design effectively uses end spacing to expand self-alignment range when mating. Easy mating is achieved via a wide self-alignment range of ±0.22mm in the pitch direction and ±0.3mm in the width direction.