Non-flammable 13W thermal gap filler is highly conformable
Stephen LawElectronics Thermal management interface materials thermal
FUJIPOLY SARCON PG130A high-performance thermal interface materials are extremely compressible. The double-sticky surface TIM is suitable for applications that have delicate or wide-variation component heights and require extremely low material compression. This low modulus thermal gap filler also helps reduce stress on the pcb during assembly. Available in thicknesses from 0.3mm to 2mm, product improves cooling performance by completely filling small and unwanted air gaps that exist between heat generating components and a nearby heatsink. Once installed, the material exhibits a thermal resistance as low as 0.02 K-in2/W at 72.5 PSI with a thermal conductivity of 13 W/m°K.
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