High thermal, semi-sintering die attach paste overcomes process challenges
HENKEL Loctite Ablestik ABP 8068T series of die attach materials includes high thermal, semi-sintering die attach pastes that provide simplified processing and best-in-class thermal and electrical performance with robust reliability for high power density devices. Materials combine high thermal conductivity, robust reliability and simplified manufacturing processes. Products provide relief at the board and component level, as well as a lead-free alternative for die attach within high power density semiconductor packages.
Print this page