High thermal impact reliability solder paste is water-soluble

SHENMAO AMERICA PF918-PW216 no-clean high thermal impact reliability solder paste adopts the newly designed high reliability lead-free alloy (Sn/4Ag/3Bi) that achieves tensile strength performance 1.4 times higher than typical SAC305 alloys. Cleanable with water, product has improved thermal cycling reliability performance suitable for automotive devices and high-power components with high thermal reliability requirements. Board-level thermal cycling test results with a real automotive IC product show that the thermal cycling life of PF918 is twice as long as the SAC305 alloy. Product is halogen-free (ORH0) and complies with RoHS 2.0 and REACH. The flux design provides ehanced voiding performance.

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