High thermal gap pads boost conductivity in power designs

HENKEL BERGQUIST GAP PAD TGP 10000ULM thermal interface materials (TIMs) address the high power density challenges associated with new 5G telecom infrastructure and consumer mobility designs. Product’s formulation provides exceptionally high thermal conductivity of 10.0W/m-K within an ultra-low modulus, low assembly stress formulation. The combination of these characteristics boosts the material’s performance. 

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