High thermal conductivity TIM addresses reliability demands

HENKEL BERGQUIST LIQUI FORM TLF 10000 gel thermal interface material (TIM) is a one-part, high thermal conductivity dispensable gel that provides robust heat transfer for high-power electronic components, improving operational efficiency and extending lifetime system reliability. Product provides 10.0W/m-K thermal conductivity and is suitable for applications where environments can be extreme or unpredictable and reliability is critical. The silicone gel material delivers on a host of other requirements for mass production of high-reliability electronics, including reliability providing high gap stability for gaps ranging from 0.5 to 1.5mm.

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