Component adhesive boosts thermal conductivity

ENGINEERED MATERIAL SYSTEMS TM-6520 low temperature cure adhesive is designed for die attach and general circuit assembly applications. Product is electrically insulating and provides high thermal conductivity of 1.7 W/°K and cures in 60 minutes at 70°C or 20 minutes at 100°C. Material is suitable for applications where the components are temperature sensitive and require a high thermally conductive adhesive for heat dissipation. Product has a 24-hour work-life and a 15,000cP viscosity at 5rpm for easy needle dispensing.