Backplane connection system enhances performance in rugged embedded designs
INTERSTATE CONNECTING COMPONENTS TE Connectivity MULTIGIG RT modular backplane system includes high-speed connectors as well as power and guidance modules. Designed to VITA 46 requirements, solutions are backward compatible with legacy VPX products and utilize printed circuit wafers for cost-effective sequencing and electrical customization of connectors. The wafers can be manufactured specifically for differential or signal-ended performance. In addition, the impedance, propagation delay and crosstalk of the connector can be altered per customer requirements. Supporting data rates of up to 32+ Gb/s, backplane solutions are lightweight and designed to withstand 500 mating cycles.