High-performance thermal putty reduces thermal resistance
FUJIPOLY AMERICA Sarcon XR-Um-Al high-performance thermal interface silicone putty is a formulated gap filler compound that has a putty-like consistency, which contributes to its extremely low contact and thermal resistance, while maintaining a thermal conductivity of 17 watt/m-k. Product is manufactured with a thin aluminum carrier film for customer-friendly application. Products low adhesion aluminum barrier enables users to remove the carrier film after installation with no pull-out effect. This thermal interface material is available in sheets up to 50mm x 50mm with thicknesses ranging from 0.2mm to 0.5mm.
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