Thin film thermal interface boosts performance

FUJIPOLY AMERICA  Sarcon YR‐c thermal interface product provides a high level of performance, based on a new formulation delivering a thermal conductivity of 4.0 W/m°K with a thermal resistance of .08°Cin2/W. When placed between a heat source such as a high‐performance semiconductor and a nearby heatsink, product eliminates near‐microscopic air gaps that exist between the components. By increasing surface area contact it is possible to measurably improve the cooling performance of the heatsink. The V‐0 rated thin film is recommended for applications with operational temperatures that range from ‐40°C to +150°C. Product is available in thicknesses of 0.2, 0.3, and 0.45mm. http://www.fujipoly.com

электросхема